| 1 |
Introduction to Microsystems & Semiconductor Packaging |
온라인 강의자료 |
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| 2 |
Role of Packaging in Microelectronics and Systems |
온라인 강의자료 |
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| 3 |
Role of Packaging in Microelectronics and Systems |
온라인 강의자료 |
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| 4 |
Fundamentals of Packaging Design |
온라인 강의자료 |
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| 5 |
Fundamentals of Thermal Management |
온라인 강의자료 |
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| 6 |
Failure Mode and Mechanisms |
온라인 강의자료 |
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| 7 |
Fatigue Approach for Microsystems Reliability |
온라인 강의자료 |
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| 8 |
Linear Elastic Fracture Mechanics Approach in Microsystems Packaging |
온라인 강의자료 |
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| 9 |
Optical Method for Displacement Measurement |
온라인 강의자료 |
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| 10 |
Optical Method for Displacement Measurement |
온라인 강의자료 |
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| 11 |
Reliability Assessment of Solder Joints in Microsystems Packaging |
온라인 강의자료 |
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| 12 |
Reliability in Wafer-Level Packaging |
온라인 강의자료 |
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| 13 |
Reliability in MEMS |
온라인 강의자료 |
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| 14 |
Virtual Reliability Prediction |
온라인 강의자료 |
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| 15 |
기말고사 |
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